Overmolding is a process where a single part is created using two or more different materials in combination. Typically the first material, sometimes referred to as the substrate, is partially or fully covered by subsequent materials (overmold materials) during the manufacturing process.
The Federal Information Processing Standard (FIPS) Publication 140-2, (FIPS PUB 140-2), is a U.S. government computer security standard used to approve cryptographic modules. The title is Security Requirements for Cryptographic Modules
Prototyping is often a part of our design process that allows our engineers to explore different design alternatives to either solve problems for existing designs or to create new products. In some cases, a series of prototypes will be designed, constructed and tested. This in turn refines the design before it is put into production.
Encapsulation is a process similar to Potting. With encapsulation instead of filling a mold with a compound like during the potting process, the electronic assembly is impregnated inside the compound with the help of a reusable mold.
Many products we mold use batteries and for this reason we have created a large assembly department capable of performing many of the necessary tasks required prior to molding electronics.