Thermoset Overmolding (TSO)

KEY INSIGHT #2 — KNOW YOUR STUFF

(TSO) Thermoset overmolding is another process typically used to encapsulate and environmentally protect electronic components (such as circuit boards, switches and sensors). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs. Thermoset overmolding materials are liquid at room temp so they can also be processed at room temperature.  Because of this feature these materials can safely overmold any pcb assembly, sensor, wire harness, electronic devices, batteries and LED components.   Since they are liquid at room temperature they are also processed at very low pressure and in some cases as low as 1 PSI.  The (TSO) process is the only process safe for molding over electronic devices with internal batteries.  These materials are also very forgiving during the molding process and can be casted over large assemblies without issues.  In one step your product can be hermetaclly sealed, packaged in a functional housing including external buttons, visible LED’s and strain relief for cables.

If you have an overmold project that sounds similar to to some of the information above give us a call.  We would love to discuss your project,  decide if its a good fit for this process and provide a quote.  Please visit us online at overmoldexpress.com to see what kind of projects we have completed in the past and to request a quote.  We would love the opportunity to earn your trust and your business

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Low Pressure Overmolding Example